发明名称 成膜方法、プログラム、コンピュータ記憶媒体及び成膜装置
摘要 <p>To appropriately form a metal-containing film containing metal on a substrate, a method first forms an organic film on the substrate, and causes a treatment agent to enter the organic film and causes metal to infiltrate the organic film via the treatment agent, thereby forming the metal-containing film. The metal-containing film contains metal and thus has a high etching selection ratio that is originally required performance. This makes it possible to appropriately form the metal-containing film having a high etching selection ratio on the substrate.</p>
申请公布号 JP5827939(B2) 申请公布日期 2015.12.02
申请号 JP20120274863 申请日期 2012.12.17
申请人 東京エレクトロン株式会社 发明人 岩尾 文子;志村 悟
分类号 H01L21/027;G03F7/38 主分类号 H01L21/027
代理机构 代理人
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