发明名称 Semiconductor device and DC-to-DC converter
摘要 In general, according to one embodiment, a semiconductor device includes a device main body, a semiconductor substrate. The device main body includes a semiconductor substrate mounting part and a first conductor provided around the semiconductor substrate mounting part. The semiconductor substrate includes a DC-to-DC converter control circuit having a detector to detect at least one of a current flowing through the first conductor and a voltage supplied to the first conductor. The semiconductor substrate is disposed on the semiconductor substrate mounting part so that the detector comes close to the first conductor.
申请公布号 US9189001(B2) 申请公布日期 2015.11.17
申请号 US201313871268 申请日期 2013.04.26
申请人 Kabushiki Kaisha Toshiba 发明人 Saito Hiroshi;Wada Ryo;Goto Yuichi
分类号 H01L27/01;G05F1/46;H02M7/00;H01L23/495 主分类号 H01L27/01
代理机构 White & Case LLP 代理人 White & Case LLP
主权项 1. A semiconductor device comprising: a semiconductor substrate including a DC-to-DC converter control circuit, the DC-to-DC converter control circuit including a first switch element, a detector connected to the first switch element, and a driver circuit driving the first switch element, the semiconductor substrate having a first terminal for power supply and a second terminal for input signals to the driver circuit, the first terminal being electrically connected to the first switch element; a first wire connecting the first terminal; and a second wire connecting the second terminal, a length of the second wire being longer than a length of the first wire.
地址 Minato-ku, Tokyo JP