发明名称 |
Semiconductor device and DC-to-DC converter |
摘要 |
In general, according to one embodiment, a semiconductor device includes a device main body, a semiconductor substrate. The device main body includes a semiconductor substrate mounting part and a first conductor provided around the semiconductor substrate mounting part. The semiconductor substrate includes a DC-to-DC converter control circuit having a detector to detect at least one of a current flowing through the first conductor and a voltage supplied to the first conductor. The semiconductor substrate is disposed on the semiconductor substrate mounting part so that the detector comes close to the first conductor. |
申请公布号 |
US9189001(B2) |
申请公布日期 |
2015.11.17 |
申请号 |
US201313871268 |
申请日期 |
2013.04.26 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Saito Hiroshi;Wada Ryo;Goto Yuichi |
分类号 |
H01L27/01;G05F1/46;H02M7/00;H01L23/495 |
主分类号 |
H01L27/01 |
代理机构 |
White & Case LLP |
代理人 |
White & Case LLP |
主权项 |
1. A semiconductor device comprising:
a semiconductor substrate including a DC-to-DC converter control circuit, the DC-to-DC converter control circuit including a first switch element, a detector connected to the first switch element, and a driver circuit driving the first switch element, the semiconductor substrate having a first terminal for power supply and a second terminal for input signals to the driver circuit, the first terminal being electrically connected to the first switch element; a first wire connecting the first terminal; and a second wire connecting the second terminal, a length of the second wire being longer than a length of the first wire. |
地址 |
Minato-ku, Tokyo JP |