| 发明名称 |
CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARATUS AND METHOD OF DOUBLE-SIDE POLISHING WAFER |
| 摘要 |
A method provides a carrier used in a double-side polishing apparatus such that the carrier is disposed between upper and lower turn tables to which polishing pads are attached in the double-side polishing apparatus and holds a wafer interposed between the upper and lower turn tables in a holding hole formed in the carrier during polishing, including upper and lower main surface portions composed of a β-titanium alloy obtained from pure titanium containing 0.5 weight % or more of a β-stabilizing element. The carrier has a high abrasion resistance and can reduce its cost. |
| 申请公布号 |
US2015321311(A1) |
申请公布日期 |
2015.11.12 |
| 申请号 |
US201314652260 |
申请日期 |
2013.12.19 |
| 申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
SASAKI Masanao;UCHIYAMA Isao |
| 分类号 |
B24B37/28;B24B37/08 |
主分类号 |
B24B37/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A carrier used in a double-side polishing apparatus such that the carrier is disposed between upper and lower turn tables to which polishing pads are attached in the double-side polishing apparatus and holds a wafer interposed between the upper and lower turn tables in a holding hole formed in the carrier during polishing, comprising
upper and lower main surface portions composed of a β-titanium alloy obtained from pure titanium containing 0.5 weight % or more of a β-stabilizing element. |
| 地址 |
Tokyo JP |
