发明名称 MANUFACTURING METHOD OF LAMINATE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminate structure capable of improving adhesiveness between a metal part such as an electroless copper plating layer and a dry film resist.SOLUTION: The manufacturing method of the laminate structure includes: a laminating step of laminating an insulator film and a backing film in this order on a substrate including a metal part in a top face or a second insulator layer including a metal part on a top face; an exfoliating step of exfoliating the backing film from a surface of the insulator film; and a plating step of forming the metal part on the insulator film by plating processing. The backing film includes ruggedness on a surface in contact with the insulator film and after the exfoliating step or before the plating step, the insulator film includes ruggedness on a surface in contact with the backing film, the ruggedness resulting from the ruggedness on the surface of the backing film.
申请公布号 JP2015195364(A) 申请公布日期 2015.11.05
申请号 JP20150051113 申请日期 2015.03.13
申请人 SEKISUI CHEM CO LTD 发明人 BABA SUSUMU;NISHIMURA TAKASHI;SHIRAHASE KAZUTAKA;KOYANAGI HIROSHI
分类号 H05K3/18;B32B15/08;H05K3/38 主分类号 H05K3/18
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