发明名称 |
MANUFACTURING METHOD OF LAMINATE STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminate structure capable of improving adhesiveness between a metal part such as an electroless copper plating layer and a dry film resist.SOLUTION: The manufacturing method of the laminate structure includes: a laminating step of laminating an insulator film and a backing film in this order on a substrate including a metal part in a top face or a second insulator layer including a metal part on a top face; an exfoliating step of exfoliating the backing film from a surface of the insulator film; and a plating step of forming the metal part on the insulator film by plating processing. The backing film includes ruggedness on a surface in contact with the insulator film and after the exfoliating step or before the plating step, the insulator film includes ruggedness on a surface in contact with the backing film, the ruggedness resulting from the ruggedness on the surface of the backing film. |
申请公布号 |
JP2015195364(A) |
申请公布日期 |
2015.11.05 |
申请号 |
JP20150051113 |
申请日期 |
2015.03.13 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
BABA SUSUMU;NISHIMURA TAKASHI;SHIRAHASE KAZUTAKA;KOYANAGI HIROSHI |
分类号 |
H05K3/18;B32B15/08;H05K3/38 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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