MOUNTING DEVICE, MANUFACTURING METHOD OF SAME, AND SPUTTERING TARGET USED IN SAID MANUFACTURING METHOD

摘要

A mounting device in which a conductive film that is not separated is formed on a resin substrate. Alloy thin films 4 and 5, which contain more than 50% by atom of Cu, 5% by atom or more and 30% by atom or less of Ni, and 3% by atom or more and 10% by atom or less of Al, are formed on a base 3 consisting of a resin so as to be brought into contact with a surface of the base 3 by sputtering. Conductive films 6 and 7 consisting of copper are formed on surfaces of the alloy thin films 4 and 5 so as to obtain a wiring film 9 having a two-layer structure and a metal plug 8 filled in a connection hole 2. The alloy thin films 4 and 5 have high adhesion to a resin; and hence, the wiring film 9 and the metal plug 8 are not separated.