发明名称 LINEAR LOW DENSITY POLYETHYLENE RESIN PARTICLE, COMPOUND RESIN PARTICLE, FOAM PARTICLE, AND FOAM MOLDED BODY
摘要 PROBLEM TO BE SOLVED: To provide seed particles capable of further improving impact resistance at a high magnification without greatly decreasing heat resistance and slow-burning properties of a foam molded body.SOLUTION: Linear low density polyethylene resin particles used for seed particles when polymerizing into seeds include a mixed resin composed of a linear low density polyethylene and an ethylene copolymer in the seed particles where the linear low density polyethylene has a softening point of 115-130°C, the ethylene copolymer is a copolymer of a (meth)acrylic acid alkyl ester with ethylene and has 1-20 wt.% of a constituent derived from (meth)acrylic acid alkyl ester, and the (meth)acrylic acid alkyl ester is selected from methyl (meth)acrylate and ethyl (meth)acrylate.
申请公布号 JP2015189911(A) 申请公布日期 2015.11.02
申请号 JP20140069584 申请日期 2014.03.28
申请人 SEKISUI PLASTICS CO LTD 发明人 OWAKI KOKI;GONDO YUICHI
分类号 C08L23/06;C08J9/04;C08K5/01;C08K5/14;C08L23/08;C08L51/06 主分类号 C08L23/06
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