发明名称 |
LINEAR LOW DENSITY POLYETHYLENE RESIN PARTICLE, COMPOUND RESIN PARTICLE, FOAM PARTICLE, AND FOAM MOLDED BODY |
摘要 |
PROBLEM TO BE SOLVED: To provide seed particles capable of further improving impact resistance at a high magnification without greatly decreasing heat resistance and slow-burning properties of a foam molded body.SOLUTION: Linear low density polyethylene resin particles used for seed particles when polymerizing into seeds include a mixed resin composed of a linear low density polyethylene and an ethylene copolymer in the seed particles where the linear low density polyethylene has a softening point of 115-130°C, the ethylene copolymer is a copolymer of a (meth)acrylic acid alkyl ester with ethylene and has 1-20 wt.% of a constituent derived from (meth)acrylic acid alkyl ester, and the (meth)acrylic acid alkyl ester is selected from methyl (meth)acrylate and ethyl (meth)acrylate. |
申请公布号 |
JP2015189911(A) |
申请公布日期 |
2015.11.02 |
申请号 |
JP20140069584 |
申请日期 |
2014.03.28 |
申请人 |
SEKISUI PLASTICS CO LTD |
发明人 |
OWAKI KOKI;GONDO YUICHI |
分类号 |
C08L23/06;C08J9/04;C08K5/01;C08K5/14;C08L23/08;C08L51/06 |
主分类号 |
C08L23/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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