发明名称 Microphone module with sound pipe
摘要 A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
申请公布号 US9173015(B2) 申请公布日期 2015.10.27
申请号 US201414223996 申请日期 2014.03.24
申请人 INVENSENSE, INC. 发明人 Harney Kieran P.;Sengupta Dipak;Moss Brian;Guery Alain V.
分类号 H04R25/00;H04R1/08;H04R1/34;H04R19/00;H04R19/04 主分类号 H04R25/00
代理机构 IPxLaw Group LLP 代理人 Imam Maryam;IPxLaw Group LLP
主权项 1. A microphone module comprising: a substrate having a first side, and a second side opposite the first side, the substrate having an aperture extending from the first side to the second side to allow sound waves to pass through the substrate; a lid directly contacting the first side, the first side and the lid defining a first interior volume; a microphone mounted to the first side and within the first interior volume; a housing coupled to the second side and covering the aperture, the housing having a top and at least one sidewall, the housing and second side forming a second interior volume, the housing including an acoustic port, the acoustic port being disposed through the top of the housing and configured to allow sound to enter the second interior volume; a pipe extending from an outside surface of the housing, the pipe having an open end to receive sound waves and direct them to an inside of the housing; and at least one exterior interface pad on the second side and outside of the second interior volume, the at least one exterior interface pad electrically coupled to the microphone.
地址 San Jose CA US