| 发明名称 |
MONOLITHIC MULTI-MODULE ELECTRONICS CHASSIS WITH MULTI-PLANAR EMBEDDED FLUID COOLING CHANNELS |
| 摘要 |
A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process. |
| 申请公布号 |
US2015305198(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201414254518 |
申请日期 |
2014.04.16 |
| 申请人 |
Raytheon Company |
发明人 |
Brandt David B.;Dodds Robert K.;Chu David W.;Allen Alicia G.;Schaefer Gregory P. |
| 分类号 |
H05K7/20;H05K13/00 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cooling system for cooling a heat source, the cooling system comprising:
a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure, wherein the monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process. |
| 地址 |
Waltham MA US |
