发明名称 SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can inhibit generation of particles from a susceptor rotation device and failure in rotating action, and deterioration in substrate processing characteristics associated with the occurrence of particles and failure in the rotating action.SOLUTION: A substrate processing apparatus comprises: a first shaft 404 as a rotation shaft for the placement part which has a substrate placement part having a substrate placement surface on which a plurality of substrates are arranged on the same circle and a heater provided inside, a first cylindrical body which forms a space for arrangement of wiring for supplying electric power to the heater and supports the substrate placement part centering on the center of the substrate placement surface; and a first rotating gear 406 provided on an outer periphery of the cylindrical body; a second shaft 407 as a shaft for a motor which has a second cylindrical body connected to rotary motor 400 and a second rotating gear 402 for transmitting a torque of the motor 400 to the first shaft 404; and a fixation part for fixing the second shaft 407.</p>
申请公布号 JP2015185757(A) 申请公布日期 2015.10.22
申请号 JP20140062169 申请日期 2014.03.25
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TAKAHASHI SATORU
分类号 H01L21/31;C23C16/458;H01L21/683 主分类号 H01L21/31
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