发明名称 METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH IMPROVED IMPLANTATION PROCESSES
摘要 Methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes providing a structure having an n-channel gate stack and a p-channel gate stack formed over a semiconductor substrate. The method includes forming halo implant regions in the semiconductor substrate adjacent the p-channel gate stack and forming extension implant regions in the semiconductor substrate adjacent the p-channel gate stack. The method further includes annealing the halo implant regions and the extension implant regions in the semiconductor substrate adjacent the p-channel gate stack by performing a laser anneal process. Also, the method forms extension implant regions in the semiconductor substrate adjacent the n-channel gate stack.
申请公布号 US2015287646(A1) 申请公布日期 2015.10.08
申请号 US201414244651 申请日期 2014.04.03
申请人 GLOBALFOUNDRIES, Inc. 发明人 Zaka Alban;Yan Ran;Bazizi El Mehdi;Hoentschel Jan
分类号 H01L21/8238;H01L29/167;H01L21/324;H01L29/66;H01L21/265;H01L21/266 主分类号 H01L21/8238
代理机构 代理人
主权项 1. A method for fabricating an integrated circuit, the method comprising: providing a structure having an n-channel gate stack and a p-channel gate stack formed over a semiconductor substrate; forming halo implant regions in the semiconductor substrate adjacent the p-channel gate stack; forming extension implant regions in the semiconductor substrate adjacent the p-channel gate stack; annealing the halo implant regions and the extension implant regions in the semiconductor substrate adjacent the p-channel gate stack by performing a laser anneal process; and forming extension implant regions in the semiconductor substrate adjacent the n-channel gate stack.
地址 Grand Cayman KY