METHOD FOR THE PRODUCTION OF A SENSOR COMPONENT, AND SENSOR COMPONENT

摘要

Disclosed are a method for producing a sensor component as well as a sensor component comprising a semiconductor substrate and a metal substrate. The semiconductor substrate and the metal substrate are interconnected using a low-temperature process. A connecting material containing metal particles is applied to the semiconductor substrate and/or the metal substrate in a first step, and a sintering process is used for creating the connection between the semiconductor substrate and the metal substrate in a second step.