| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device whose manufacturing time can be reduced. <P>SOLUTION: In a step S1, original data (bit string) [126:0] having 127 bit length are input. The process proceeds to a step S2 and it is decided whether the number of bits of "1" in the bit string [126:0] input in the step S1 is greater than half (that is,≥64) of the total bits. When the number of the bits of "1" is≥64, the process proceeds to a step S3. In the step S3, the bit string [126:0] is reversed and bit [127] as a reversed bit is set to "1" and then the process proceeds to a step S5. In the step S5, fuses corresponding to the bit string [126:0] and the bit [127] respectively are cut by LT (laser trimming). <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
