发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <p>A manufacturing method of a semiconductor device is provided to improve a device property such as a refresh of a semiconductor device by improving a short channel effect without usage of a high cost device. A device isolation film(13) defines an active region, and is formed on a top of a semiconductor substrate(11). A hard mask film(15) and a photoresist film are successively formed on a top of the semiconductor substrate including the device isolation film. A first photoresist pattern is formed by using a lithography process. A second photoresist pattern is formed by using the first photoresist pattern. A hard mask film pattern is formed by etching the hard mask film. A first recess is formed by etching the semiconductor substrate. A second recess(23) is formed by vertically etching the semiconductor substrate of a bottom of the first recess.</p>
申请公布号 KR20090036806(A) 申请公布日期 2009.04.15
申请号 KR20070102072 申请日期 2007.10.10
申请人 HYNIX SEMICONDUCTOR INC. 发明人 JUNG, HUN ROK;CHO, DAE HEE
分类号 H01L21/336;H01L29/78 主分类号 H01L21/336
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