发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
<p>A manufacturing method of a semiconductor device is provided to improve a device property such as a refresh of a semiconductor device by improving a short channel effect without usage of a high cost device. A device isolation film(13) defines an active region, and is formed on a top of a semiconductor substrate(11). A hard mask film(15) and a photoresist film are successively formed on a top of the semiconductor substrate including the device isolation film. A first photoresist pattern is formed by using a lithography process. A second photoresist pattern is formed by using the first photoresist pattern. A hard mask film pattern is formed by etching the hard mask film. A first recess is formed by etching the semiconductor substrate. A second recess(23) is formed by vertically etching the semiconductor substrate of a bottom of the first recess.</p> |
申请公布号 |
KR20090036806(A) |
申请公布日期 |
2009.04.15 |
申请号 |
KR20070102072 |
申请日期 |
2007.10.10 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
JUNG, HUN ROK;CHO, DAE HEE |
分类号 |
H01L21/336;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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