发明名称 HEAT PIPE
摘要 A cooling unit main body 25 having vapor diffusion flow paths 42 which extend to the peripheral portion and capillary flow paths 41 formed between the vapor diffusion flow paths 42 and in a concave portion opposite region 47 is provided with a thin concave portion 6 in which an LED chip 2 is mounted. Accordingly, heat from the LED chip 2 can be easily transferred by what corresponds to the thinning of the concave portion 6, and successive circulating phenomenon caused by a refrigerant W is repeated by the heat, and the heat is surely drawn from the LED chip 2 by latent heat at a time when the refrigerant W vaporizes, so that a heat pipe 5 can maintain the light emitting state of the LED chip 2 stably.
申请公布号 EP2003703(A9) 申请公布日期 2009.04.15
申请号 EP20070708068 申请日期 2007.02.05
申请人 FUCHIGAMI MICRO CO.,LTD. 发明人 UEDA, SUSUMU;OHSAWA, KENJI;TSURUTA, KATSUYA;KOTANI, TOSHIAKI
分类号 H01L33/62;H01L33/64;H01S5/024 主分类号 H01L33/62
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