| 摘要 |
A purpose of the present invention is to provide a silicone adhesive composition which comprises no antioxidant, has sufficient adhesive and tack properties, has excellent heat resistance and which, in tested use, leaves no adhesive residue. Another purpose is to provide adhesive film and tape having a cured layer obtained from the composition. The invention provides an addition curable or peroxide curable silicone adhesive composition, wherein the addition curable silicone adhesive composition comprises
(A1) a diorganopolysiloxane having an alkenyl group and a viscosity at 25 degrees C of 100,000 mPa·s or more,
(B) an organopolysiloxane having R 1 3 SiO 0.5 units and SiO 2 units, wherein R 1 is a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms,
(C) an organohydrogenpolysiloxane having at least three SiH groups,
(D) optionally an addition reaction inhibitor,
(E) a platinum group metal catalyst for an addition reaction, and
(F) an organic solvent, and
the peroxide curable silicone adhesive composition comprises
(A2) a diorganopolysiloxane having a viscosity at 25 degrees C of 100,000 mPa·s or more and may or may not have an alkenyl group,
(B) an organopolysiloxane having R 1 3 SiO 0.5 units and SiO 2 units, wherein R 1 is a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atom,
(F) an organic solvent, and
(G) an organic peroxide,
and components (A1) and (A2) may be accompanied with octamethylcyclotetrasiloxane and/or decamethylcyclopentasiloxane and each content of octamethylcyclotetrasiloxane and decamethylcyclopentasiloxane is less than 0.1 mass %, based on a total amount of component (A1) or (A2), component (B) and octamethylcyclotetrasiloxane and decamethylcyclopentasiloxane. |
