Camera module including flip chip image sensor

摘要

Various embodiments are directed to a camera module, image sensor die, and methods for manufacturing the same. The image sensor die comprises a thinned wafer portion, a photosensor portion adjacent the thinned wafer portion and a carrier wafer. Vias may be formed through the carrier wafer to connect the photosensor portion to die contacts. A first side of the image sensor die opposite the die contacts may be bonded to a first side of the rigid substrate. Wire bonds may be formed between the die contacts and substrate-sensor contacts positioned on the first side of the rigid substrate.

主权项

1. A camera module, comprising:
a lens module comprising a lens housing and at least one lens; an image sensor module comprising:
a rigid substrate having an image sensor opening, the rigid substrate comprising:
an upper side coupled to the lens housing; anda lower side comprising a plurality of substrate-sensor contacts; andan image sensor die mechanically coupled to the lower side of the rigid substrate, the image sensor die comprising:
a photosensor portion;a thinned wafer portion adjacent the photosensor portion, wherein the photosensor portion is positioned to receive optical energy through the image sensor opening and the thinned wafer portion, and wherein at least a portion of the optical energy received by the photosensor portion is transmitted through the image sensor opening and the thinned wafer portion to the photosensor portion; anda carrier wafer portion comprising a first side adjacent the photosensor portion and a second side opposite the first side, the carrier wafer portion comprising a plurality of die contacts, the plurality of die contacts being positioned on the second side of the carrier wafer portion, and wherein each of the plurality of die contacts is electrically coupled to at least one of the plurality of substrate-sensor contacts with a wire bond.