发明名称 SOLDERING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a soldering iron and a soldering apparatus, each having a simple structure, capable of suppressing cost increase, and soldering accurately and efficiently.SOLUTION: A soldering apparatus A includes a cylindrical iron tip 5 having an open hole 51 formed thereon through which solder Wh is supplied, a heater unit 4 for heating the iron tip 5, a temperature acquisition part 7 for acquiring the temperature of the iron tip 5, and a control part 8 for controlling output of the heater unit 4(41) on the basis of the temperature of the iron tip 5 acquired by the temperature acquisition part 7.</p>
申请公布号 JP2015166098(A) 申请公布日期 2015.09.24
申请号 JP20140040759 申请日期 2014.03.03
申请人 AND CO LTD 发明人 EBISAWA MITSUO
分类号 B23K3/04;B23K1/00;B23K3/02;B23K3/06;H05K3/34 主分类号 B23K3/04
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