| 摘要 |
<p>A method of manufacturing a heat sink structure for a high-power LED, comprising the following steps: 1. preparing a PCB (4) such that one side thereof is provided with a heat-conductive plate (6) having a heat-conductive column (8), and a heat sink plate (9); 2. forming a positioning hole (7) that passes through the two sides of PCB (4), providing a copper plating layer (5) on one side of the PCB (4), and providing an electrode fillet weld (3) on the other side of the PCB (4); and coating the surface of the copper plating layer (5) with tin soldering paste; 3. inserting the heat-conductive column (8) into the positioning hole (7) from the side of the PCB (4) having the copper plating layer (5), and soldering the copper plating layer (5) to the heat-conductive plate (6) by means of reflow soldering; 4. placing on a stamping apparatus the integral whole formed in step 3. by the heat-conductive plate (6) and the PCB (4), so as to modify the height of the heat-conductive column (8); 5. fixedly adhering the inner side of the heat sink plate (9) to the other side of the heat-conductive plate (6).</p> |
