| 摘要 |
<p>The present invention relates to a device for measuring wafer defects, capable of simultaneously measuring defects on the lateral side and upper and lower sides of a wafer and preventing damage to the wafer. The present invention provides the device for measuring the wafer defects which includes a lower blower which floats the wafer by spraying air to the lower side of the wafer, an upper blower which is formed to be lifted with regard to the lower blower and fixes the wafer by spraying the air to the upper side of the wafer, an upper contamination measuring unit which is formed on the upper side of the upper blower and senses contamination on the upper side of the wafer, a lower contamination measuring unit which is formed on the lower side of the lower blower and senses the contamination on the lower side of the wafer, and a lateral side contamination measuring unit which is formed between the upper and lower blowers and senses the contamination on the lateral side of the wafer.</p> |
