发明名称 気相成長方法及び気相成長装置
摘要 <p>A vapor growth apparatus according to an aspect of the present invention includes a reaction chamber into which a wafer is loaded, a first valve which is connected to the reaction chamber and controls a flow rate of a first exhaust gas discharged from the reaction chamber, a first pump which is provided on a downstream side of the first valve and discharges the first exhaust gas, a first pressure gauge which detects a first pressure that is a pressure of the reaction chamber, a first pressure control unit which controls the first valve based on the first pressure, a second pressure gauge which detects a second pressure that is a pressure between the first valve and the first pump, and a second pressure control unit which controls an operation volume of the first pump based on the first pressure and the second pressure.</p>
申请公布号 JP5750328(B2) 申请公布日期 2015.07.22
申请号 JP20110158582 申请日期 2011.07.20
申请人 发明人
分类号 H01L21/205;C23C16/44 主分类号 H01L21/205
代理机构 代理人
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