| 摘要 |
<p>According to an embodiment of the present invention, a chip on film package comprises: a base film; a semiconductor chip mounted on the base film; a plurality of first pads formed on one side edge of the base film, and connected with a pad of a flat display panel; and a first wiring pattern printed on the base film to connect each first pad and the semiconductor chip. At least a part of the first pads is lengthily formed on other parts. Accordingly, inspection regarding connection between the first pads and the pad of the flat display panel can be easily performed by using a part which is lengthily formed among the first pads.</p> |
