HEAT EXCHANGE DEVICE WITH RING SHAPED THIN SLIT SECTION FOR USE IN LIQUID ADHESIVE SYSTEMS AND RELATED METHODS

摘要

A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section in the form of an elongated ring shape, having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange device further includes a heating element for heating the liquid adhesive material flowing through the thin slit section.

主权项

1. A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application, comprising:
a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application, a fluid passageway defined in said body connecting said inlet and said outlet and configured to receive the flow of liquid adhesive material, said fluid passageway including a thin slit section having a length along a fluid flow direction between said inlet and said outlet, said thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction, the first dimension and the length being substantially greater than the second dimension, wherein a profile of said thin slit section is a ring, the first dimension is a circumference of the ring, and the second dimension is a radial thickness of the ring, and at least one heating element thermally coupled with said body and configured for heating the liquid adhesive material flowing through said fluid passageway to the application temperature.