发明名称 Device for Cutting a Substrate and Method for Controlling Such a Cutting Device
摘要 A device for cutting a substrate along a cutting line is disclosed. The device includes a saw unit with a saw blade, which can be rotated around an axis of rotation, a guide carriage for moving the saw unit along a guide rail, and a control device for controlling the saw unit and the guide carriage. A marking device is provided for marking an end point of the cutting line.
申请公布号 US2015151451(A1) 申请公布日期 2015.06.04
申请号 US201514617660 申请日期 2015.02.09
申请人 Hilti Aktiengesellschaft 发明人 FLOCK Marcus
分类号 B28D7/00;B28D1/10;B28D1/04 主分类号 B28D7/00
代理机构 代理人
主权项 1. A device for cutting a substrate along a cutting line, comprising: a saw unit with a saw blade, wherein the saw blade is rotatable around an axis of rotation; a guide carriage, wherein the saw unit is movable by the guide carriage along a guide rail; a control device, wherein the saw unit and the guide carriage are controllable by the control device; and a marking device associated with the guide rail, wherein an end point of the cutting line is markable by the marking device; wherein the marking device has an optical marking element, a signal generator, and a detector device, wherein the end point is optically markable by the optical marking element, wherein a position signal corresponding to a position of the end point or a position of a reference point which is arranged at a defined distance from the end point is emittable by the signal generator, and wherein the position signal is receivable by the detector device.
地址 Schaan LI