发明名称 METHOD OF ATTRACTING OBJECT TO BE ATTRACTED ONTO PLACING TABLE, AND PROCESSING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide an apparatus capable of suppressing reduction in attraction force of an electrostatic chuck, and suppressing residual charge on a surface of the electrostatic chuck.SOLUTION: There is provided a method of attracting an object to be attracted onto a placing table. The placing table, in a processing apparatus for processing a body to be processed in a space that can be decompressed, is provided in a processing container that defines the space. In addition, the processing apparatus is a plasma processing apparatus, for example. The method includes a step of placing the object to be attracted on an electrostatic chuck of the placing table, and a step of applying three AC voltages having phases different from one another to three electrodes of the electrostatic chuck, respectively.</p>
申请公布号 JP2015099839(A) 申请公布日期 2015.05.28
申请号 JP20130238854 申请日期 2013.11.19
申请人 TOKYO ELECTRON LTD 发明人 SASAKI YASUHARU;FUSHIMI AKIHITO
分类号 H01L21/683;H02N13/00 主分类号 H01L21/683
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