| 摘要 |
A method of repairing matrix microcracks in MI-CMC components includes heating "free" silicon phase present within the cracked matrix portion of the component to a temperature above the melting point of the silicon phase. During heating of the component an additional source of silicon phase is supplied to the component. The atmosphere about the component is controlled during the heating of the component. The MI-CMC component is cooled below the melting point of the silicon phase to cool and solidify the silicon phase that has migrated into the microcracks to thereby bond the crack faces together. |
