WAFER LEVEL PACKAGING DEVICE

摘要

Provided is a wafer level packaging device. The wafer level packaging device includes a lower sensor substrate having a sensor, an upper cap substrate which is provided on the lower sensor substrate and has a cavity formed on a surface thereof to receive the sensor; and a metal solder layer which is bonded to the lower sensor substrate and the upper cap substrate. The upper cap substrate is an SOI wafer. The cavity is formed by successively removing the lower Si layer of the SOI wafer and an insulating layer.