发明名称 化合物半導体装置及びその製造方法
摘要 <p>A compound semiconductor device includes: an electron transport layer formed over a substrate; an electron supply layer formed over the electron transport layer; and a cap layer formed over the electron supply layer; the cap layer includes a first compound semiconductor layer containing GaN; a second compound semiconductor layer containing AlN, which is formed over the first compound semiconductor layer; a third compound semiconductor layer containing GaN, which is formed over the second compound semiconductor layer; and at least one of a first AlGaN-containing layer and a second AlGaN-containing layer, with the first AlGaN-containing layer formed between the first compound semiconductor layer and the second compound semiconductor layer and the Al content increases toward the second compound semiconductor layer, and the second AlGaN-containing layer formed between the second compound semiconductor layer and the third compound semiconductor layer and the Al content increases toward the second compound semiconductor layer.</p>
申请公布号 JP5712583(B2) 申请公布日期 2015.05.07
申请号 JP20100269673 申请日期 2010.12.02
申请人 发明人
分类号 H01L21/338;H01L29/778;H01L29/812;H02M3/155 主分类号 H01L21/338
代理机构 代理人
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