| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component support device and an electronic device of high reliability, being excellent in heat radiation characteristic and hard to cause such problem as a jointing strength degrades because of heating during operation and fluctuation in electrical characteristic. <P>SOLUTION: A substrate 1 includes a through electrode 21 and a plurality of columnar heat sinks 3, with one surface containing a recess 11 which is to be an electronic component arrangement region. The through electrode 21 penetrates the substrate 1 along thickness direction, with an end being exposed from the inner surface of the recess 11. The columnar heat sinks 3 are provided along the thickness direction of the substrate 1, being arranged with a short interval to surround the recess 11, with respective one ends connected in common to a heat radiation layer 51 stuck to the other surface of the substrate 1. An electronic component 6 is arranged inside the recess 11 of the substrate 1, and an electrode 601 provided on one surface is connected to one end of the through electrode 21. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
