| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device by MAP molding, which allows an area of sealing mold resin to be changed without adding a step for removing mold resin after dicing cut and using a special metal mold.SOLUTION: In a method for manufacturing substrates 10 which are diced into individual pieces after preparing a plate material 100 having a plurality of substrate forming regions 110, arranging electronic components 20-22 in each substrate forming region 110 and sealing one face 101 of the plate material 100 with mold resin 30, water soluble resin 200 that is dissolved in cutting water is arranged, with a width W1 larger than a width W2 of a dicing blade 400, on a dicing line DL on the one face 101 of the plate material 100 before a molding step, and the water soluble resin 200 is dissolved and removed with the cutting water while cutting the water soluble resin 200 together with the plate material 100 in the dicing cut.</p> |
