| 发明名称 |
THERMOSETTING RESIN COMPOSITION AND USE THEREOF |
| 摘要 |
A thermosetting resin composition, comprising a thermosetting resin, an inorganic filler and an organic molybdenum compound. The thermosetting resin composition is used for preparing a resin adhesive and a prepreg, wherein the prepreg is used for laminates and printed circuit boards. |
| 申请公布号 |
WO2015051541(A1) |
申请公布日期 |
2015.04.16 |
| 申请号 |
WO2013CN85071 |
申请日期 |
2013.10.11 |
| 申请人 |
SHENGYI TECHNOLOGY CO.,LTD. |
发明人 |
DU, CUIMING;HAO, LIANGPENG;CHAI, SONGGANG |
| 分类号 |
C08L63/00;C08G59/40;C08J5/24;C08K13/02;C08L83/04;H05K1/03 |
主分类号 |
C08L63/00 |
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