| 摘要 |
PROBLEM TO BE SOLVED: To prevent leakage of an encapsulation resin from a gap between a lead frame and the resin or entrance of foreign matters such as ambient air, moisture or solder.SOLUTION: A flange 10 is formed at the side of lead frames 1 and 2, which are exposed in an opening of at least resin part 3. With this, the adhesion force is increased between the lead frames 1 and 2 and the resin. Thus, leakage of an encapsulation resin from a gap between a lead frames 1 and 2 or entrance of foreign matters such as ambient air, moisture or solder are prevented. |
