A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.
申请公布号
WO2015021287(A3)
申请公布日期
2015.04.09
申请号
WO2014US50165
申请日期
2014.08.07
申请人
INTERNATIONAL TEST SOLUTIONS, INC.
发明人
HUMPHREY, ALAN, E.;BROZ, JERRY, J.;DUVALL, JAMES, H.