| 摘要 |
<p>The present invention provides a substrate treating apparatus. The substrate treating apparatus comprises: a chamber; a substrate supporting unit; a liner unit; a heater; a gas supply unit; and a gas discharging unit, etc. A body and an inner cover in an upper surface of the body are provided to the substrate supporting unit. A space is formed between an internal cover and a body. In order to form a space, a spacer may be provided. To align the internal cover, an alignment pin may be provided.</p> |
