Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics

摘要

A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

主权项

1. A device operable to be mounted onto a surface of a board, comprising:
at least one gyroscope; at least one accelerometer, the at least one gyroscope and the at least one accelerometer communicably coupled to an application specific integrated circuit (ASIC) implemented on a silicon substrate, wherein the accelerometer and the gyroscope are vertically stacked and attached to the silicon and form a single chip; the at least one gyroscope is operable to provide the ASIC with first measurement outputs corresponding to measurement of rotation about three axes, wherein the three axes are orthogonal to each other; the at least one accelerometer is operable to provide the ASIC with second measurement outputs corresponding to measurement of linear acceleration along three axes, wherein the three axes are orthogonal to each other; the ASIC includes at least one analog to digital converter (ADC), a built-in logic, and a memory, wherein the ADC converts data related to the first measurement outputs and the second measurement outputs into digital data and the built-in logic processes the digital data.