MIXED-PLATFORM APPARATUS, SYSTEMS, AND METHODS FOR SUBSTRATE PROCESSING

摘要

An electronic device manufacturing system may include a mainframe to which one or more process chambers of different size may be coupled. A different number of process chambers may be coupled to each facet (i.e., side wall) of the mainframe. The process chambers coupled to one facet may be of a different size than process chambers coupled to other facets. For example, one process chamber of a first size may be coupled to a first facet, two process chambers each of a second size different than the first size may be coupled to a second facet, and three process chambers each of a third size different than the first and second sizes may be coupled to a third facet. Other configurations are possible. The mainframe may have a square or rectangular shape. Methods of assembling an electronic device manufacturing system are also provided, as are other aspects.

主权项

1. An electronic device manufacturing system, comprising:
a mainframe comprising a transfer chamber and a plurality of facets defining side walls of the transfer chamber, each of the plurality of facets configured to couple to one or more process chambers or load lock chambers, each one of the plurality of facets having one or more substrate access ports; wherein: a first one of the plurality of facets has a first number of substrate access ports; and a second one of the plurality of facets has a second number of substrate access ports, the second number different than the first number.