发明名称 DEVICE WITH HEAT INSULATION STRUCTURE
摘要 Embodiments of the present invention provide an apparatus with a heat insulation structure, where the apparatus includes an object to be heat-insulated (10) and also includes a heat insulation closed layer (20), disposed between the object to be heat-insulated (10) and a heat source (30). The heat insulation structure adopted in the present invention specifically is a heat insulation closed layer (20), where the heat insulation closed layer (20) performs heat insulation protection through a closed space between the object to be heat-insulated (10) and the heat source (30), rather than performing heat insulation mainly through a physical material with a small heat conduction coefficient. By performing heat insulation through the closed space, heat conducted through direct contact is reduced, and the closed space can effectively decrease heat transmission in forms of heat convection and heat radiation, solving a problem that heat is transferred from the heat source to the object to be heat-insulated, improving a heat insulation effect and lowering the temperature of a work environment of the object to be heat-insulated.
申请公布号 EP2661164(A4) 申请公布日期 2015.03.25
申请号 EP20110789253 申请日期 2011.06.14
申请人 HUAWEI DEVICE CO., LTD. 发明人 ZOU, JIE;ZHOU, LIECHUN;WU, XIJIE;YANG, JUN
分类号 H05K7/20;H05K5/02 主分类号 H05K7/20
代理机构 代理人
主权项
地址