发明名称 基板処理装置及び半導体装置の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide substrate processing equipment capable of preventing decrease in temperature around a terminal part of a heating body in the inside of a chamber to improve temperature uniformity across the entire circumference of the heating body. <P>SOLUTION: Substrate processing equipment comprises: a heat insulating wall 41 formed in a cylindrical shape; a cylindrical processing chamber for processing a substrate surrounded by the heat insulating wall 41; a helical heating body 45 provided between the processing chamber and the heat insulating wall 41, for heating the processing chamber, the heating body partially penetrating through the heat insulating wall and being pulled out as a terminal part from the intermediate part of the inside of the heat insulating wall to the outside after being increased in its cross sectional area, so that electrical power supplied through the terminal part allows a portion of the heating body extending to the intermediate part of the inside of the heat insulating wall to heat, thereby preventing decrease in temperature of the heating body on an inner wall surface of the heat insulating wall. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5686467(B2) 申请公布日期 2015.03.18
申请号 JP20100232460 申请日期 2010.10.15
申请人 发明人
分类号 H01L21/31;H01L21/205;H05B3/00 主分类号 H01L21/31
代理机构 代理人
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