| 摘要 |
<p>The present invention relates to a photosensitive resin composition and, more specifically, to a photosensitive resin composition which inhibits undercut of the bottom of a pattern and can obtain an insulator film having excellent adhesion and uniformity of the pattern by including a light absorbent represented by chemical formula 1. Also, according to the present invention, the photosensitive resin composition has excellent decomposition ability, can obtain rapid sensitivity and high transmittance, and has chemical resistance and thermal resistance.</p> |
