| 摘要 |
<p>In order to enable formation of a hardened film on a printed circuit board enabling an image to be properly developed, insulation performance to be maintained for prolonged periods of time, and mechanical strength to be kept at exceptional levels, a photosensitive composition contains (A) a carboxyl-group-containing photosensitive compound, (B) a photopolymerization initiator, (C) an epoxy compound, and optionally (D) a photosensitive compound not having a carboxyl group, the amount of double bonds in the photosensitive composition when no organic solvent or filler is contained therein being at least 400 eq. Another embodiment is a photosensitive composition containing (A') a carboxyl-group-containing compound, (B) a photopolymerization initiator, and (C) an epoxy compound, wherein there are 1.5-4 eq of epoxy groups of the epoxy compound (C) per equivalent of carboxyl groups of the carboxyl-group-containing compound (A'), and the liquid components included in the photosensitive composition constituting 5-30 percent by mass of all components excepting organic solvents and fillers.</p> |
