发明名称 Silicon wafer of mixed structure using wet etching process and preparing thereof
摘要 <p>The present invention relates to a silicon wafer of a mixed structure using a wet etching process and a manufacturing method thereof. More particularly, in a silicon wafer which has orientation and a pyramid pattern by wet etching, nanowires are formed in the crystal direction of silicon on the pyramid pattern. Provided is a pyramid and nanowire silicon wafer having a mixed structure using a wet etching process.</p>
申请公布号 KR20150012471(A) 申请公布日期 2015.02.04
申请号 KR20130088015 申请日期 2013.07.25
申请人 发明人
分类号 H01L31/0236;H01L31/04;H01L31/18 主分类号 H01L31/0236
代理机构 代理人
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