| 摘要 |
一种半导体封装件之制法，系包括：提供一承载板，其上形成有剥离层、包覆该剥离层的临时层、以及形成于该临时层上之黏着层；于该黏着层上设置半导体晶片；于该黏着层上形成包覆该半导体晶片之封装胶体；移除该承载板周缘处之该临时层，以外露该剥离层；移除该承载板与剥离层；以及移除该临时层与黏着层，以外露该半导体晶片。本发明能使半导体封装件之制作更为顺利。; and disposing a semiconductor chip on the attaching layer; and forming an encapsulant on the attaching layer to encapsulate the semiconductor chip; removing parts of the temporary layer around the peripheral of the carrier board to expose the detaching layer; removing the carrier board and the detaching layer; and removing the temporary layer and the attaching layer to expose the semiconductor chip, thereby facilitating manufacturing processes. |
