| 摘要 |
The purpose of the present invention is to provide a cover tape for packaging electronic components which makes it possible to shorten the manufacturing time and reduces the number of defects caused by fluctuations in the temperature of the sealing iron. The cover tape for packaging electronic components according to the present invention includes a base material layer and a sealant layer, and is adhered to a carrier tape. The melting point of the main component of the resin composition that constitutes the sealant layer is equal to or less than 100ºC. The cover tape for packaging electronic components exhibits, under specified measurement conditions, a peeling strength (A) when peeled after being heat sealed to a polycarbonate sheet with a sealant layer therebetween for 0.015 seconds at 220ºC, and, under specified measurement conditions, a peeling strength (C) when peeled after being heat sealed to a polycarbonate sheet with a sealant layer therebetween for 0.015 seconds at 180ºC, such that conditional expressions (1) and (2) are satisfied. After peeling, part of the sealant layer remains on the carrier tape surface to which the sealant layer was adhered. Conditional Expression (1): 20(g)≦̸A≦̸70(g) Conditional Expression (2): 0.43≦̸C/A≦̸1.0 |
