发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device (DRAM) comprising a transistor in which a gate electrode is embedded into a groove. ! SOLUTION: A method of manufacturing a semiconductor device comprises the steps of: forming a first liner film 47 covering an upper surface of an embedded gate electrode 44 and side walls of upper portions 27-2 and 28-2 of a groove; forming a burying insulation film 53 so as to bury the upper portions of the groove via the first liner film; selectively removing a portion of a groove forming mask 25 which is located on a first impurity diffusion region and thereby forming a bit contact opening 57 which exposes an upper surface of the first impurity diffusion region 33; performing a preliminary treatment of the upper surface of the first impurity diffusion region which is exposed from the bit contact opening, using a chemical solution with which the groove forming mask and the first liner film are hardly etched and a silicon oxide film is selectively etched; and formin
申请公布号 JP2015002301(A) 申请公布日期 2015.01.05
申请号 JP20130127036 申请日期 2013.06.17
申请人 PS4 LUXCO S A R L 发明人 MAEDA TAKESHI
分类号 H01L21/8242;H01L21/28;H01L27/108;H01L29/417 主分类号 H01L21/8242
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