| 发明名称 |
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE |
| 摘要 |
To obtain a semiconductor module that can fix itself onto a fixing object while enabling further miniaturization, in addition to alleviating load applied on a molded resin, a semiconductor module includes: a semiconductor element; a placing frame on which the semiconductor element is placed; a control substrate onto which a control component for controlling the semiconductor element is mounted; and a molded resin in which the semiconductor element, the placing frame, and the control substrate are integrally molded. Fixing bases exposed from the molded resin are provided on the control substrate for fixing the semiconductor module onto a chassis. |
| 申请公布号 |
US2015001702(A1) |
申请公布日期 |
2015.01.01 |
| 申请号 |
US201214378420 |
申请日期 |
2012.05.17 |
| 申请人 |
Kawauchi Yuki;Kitai Kiyofumi |
发明人 |
Kawauchi Yuki;Kitai Kiyofumi |
| 分类号 |
H01L23/16;H01L23/28;H01L23/02;H01L23/12 |
主分类号 |
H01L23/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor module comprising:
a semiconductor element; a placing frame on which the semiconductor element is placed; a control substrate onto which a control component for controlling the semiconductor element is mounted; and a molded resin in which the semiconductor element, the placing frame, and the control substrate are integrally molded, wherein a fixing base exposed from the molded resin is provided on the control substrate for fixing the semiconductor module onto a chassis. |
| 地址 |
Chiyoda-ku JP |
