COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD

摘要

Provided are: a compound containing a phenolic hydroxyl group and having superior heat resistance and flame resistance of the cured product; a phenolic resin containing same; a curable composition and cured product thereof; a semiconductor sealing material; and a printed circuit board. The compound containing a phenolic hydroxyl group is characterized by having a molecular structure represented by general formula (I) [in the formula, X is a structural site represented by structural formula (x1) or (x2) {in formula (x1) and (x2), k is an integer from 1 to 3, m is 1 or 2, and Ar is a structural site represented by structural formula (Ar1) (in the formula, r is 1 or 2). When k or m is 2 or greater, the plurality of Ar groups may be the same or different}].