发明名称 Light emitting device package
摘要 Disclosed is a light emitting device package (100) including a body (20) having a cavity (25) therein, first and second recesses inside the cavity in the body, first and second electrode layers (22, 24) in the first and second recesses, a light emitting device on the first and second electrode layers, and first and second bumps (18, 19) provided under the light emitting device and fixed into the first and second recesses.
申请公布号 EP2806471(A1) 申请公布日期 2014.11.26
申请号 EP20140166559 申请日期 2014.04.30
申请人 LG INNOTEK CO., LTD. 发明人 CHOI, BYEONG KYUN;SEO, JAE WON;CHOO, SUNG HO
分类号 H01L33/48;H01L23/00;H01L33/62;H01L33/64 主分类号 H01L33/48
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