发明名称 LIQUID COMPOSITION, METAL FILM, CONDUCTIVE WIRING LINE, AND METHOD FOR PRODUCING METAL FILM
摘要 <p>Provided is a metal film which has less voids and good electrical conductivity, while exhibiting good adhesion to a base. A liquid composition which contains: (a) a mixture of (i) an organic metal compound and (ii) at least one compound that is selected from the group consisting of aliphatic amines and aliphatic thiols, in said mixture the molar ratio of the content of the component (ii) to the content of the component (i), namely (ii)/(i), being 0.9-1.2; (b) metal oxide particles; and (c) a solvent.</p>
申请公布号 KR20140134304(A) 申请公布日期 2014.11.21
申请号 KR20147027079 申请日期 2013.02.20
申请人 FUJIFILM CORPORATION 发明人 YASUDA TAKAYASU
分类号 H01B1/22;C22B5/02;C23C18/14;H01B5/14;H01B13/00;H05K1/09 主分类号 H01B1/22
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