发明名称 Electroless plating performance of laser direct structuring materials
摘要 Thermoplastic compositions that are capable of being used in a laser direct structuring process to provide enhanced plating performance and good mechanical properties. The compositions of the present invention include a thermoplastic base resin, a laser direct structuring additive and a white pigment. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.
申请公布号 US8883900(B2) 申请公布日期 2014.11.11
申请号 US201113280846 申请日期 2011.10.25
申请人 Sabic Global Technologies B.V. 发明人 Jiang Siguang;Meng Jiru;Zou Xiangping (David)
分类号 C08K3/18;C08K3/22 主分类号 C08K3/18
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP
主权项 1. A thermoplastic composition, consisting essentially of: a) from 65 to 92% by weight of a thermoplastic base resin, wherein the thermoplastic base resin is selected from polycarbonate, a polycarbonate/acrylonitrile-butadiene-styrene resin blend; a poly(arylene ether) resin, a nylon-based resin, a polyphthalamide resin, a polyphenylene oxide resin or a combination including at least one of the foregoing resins; b) from 0.5 to 20% by weight of a laser direct structuring additive; and c) from 0.5 to 15% by weight of at least one pigment selected from TiO2 including anatise, rutile, coated and uncoated, ZnO, BaSO4, CaCO3, BaTiO3 or a combination including at least one of the foregoing pigments; wherein the thermoplastic composition is capable of being plated after being activated using a laser, wherein laser activation of the composition exposes metal atoms of the laser direct structuring additive such that metal seeds are formed on areas of the composition activated by the laser.
地址 NL