发明名称 |
Electroless plating performance of laser direct structuring materials |
摘要 |
Thermoplastic compositions that are capable of being used in a laser direct structuring process to provide enhanced plating performance and good mechanical properties. The compositions of the present invention include a thermoplastic base resin, a laser direct structuring additive and a white pigment. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications. |
申请公布号 |
US8883900(B2) |
申请公布日期 |
2014.11.11 |
申请号 |
US201113280846 |
申请日期 |
2011.10.25 |
申请人 |
Sabic Global Technologies B.V. |
发明人 |
Jiang Siguang;Meng Jiru;Zou Xiangping (David) |
分类号 |
C08K3/18;C08K3/22 |
主分类号 |
C08K3/18 |
代理机构 |
Cantor Colburn LLP |
代理人 |
Cantor Colburn LLP |
主权项 |
1. A thermoplastic composition, consisting essentially of:
a) from 65 to 92% by weight of a thermoplastic base resin, wherein the thermoplastic base resin is selected from polycarbonate, a polycarbonate/acrylonitrile-butadiene-styrene resin blend; a poly(arylene ether) resin, a nylon-based resin, a polyphthalamide resin, a polyphenylene oxide resin or a combination including at least one of the foregoing resins; b) from 0.5 to 20% by weight of a laser direct structuring additive; and c) from 0.5 to 15% by weight of at least one pigment selected from TiO2 including anatise, rutile, coated and uncoated, ZnO, BaSO4, CaCO3, BaTiO3 or a combination including at least one of the foregoing pigments; wherein the thermoplastic composition is capable of being plated after being activated using a laser, wherein laser activation of the composition exposes metal atoms of the laser direct structuring additive such that metal seeds are formed on areas of the composition activated by the laser. |
地址 |
NL |