COPPER FOIL WITH A CARRIER, PRINTED WIRING BOARD, COPPER-CLAD LAMINATE, ELECTRONIC APPARATUS AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a carrier that allows good laser holing of ultra-thin copper layer and is suitable in the preparation of high density integrated circuit board.SOLUTION: A copper foil with a carrier comprising a carrier, an intermediate layer laminated on the carrier, and an ultra-thin copper layer laminated on the intermediate layer, characterized in that when the copper foil with a carrier is heated at 220°C for 2 hours, followed by peeling off the ultra-thin copper layer in accordance with JIS C6471, the surface roughness Ra on the intermediate layer side of the ultra-thin copper layer measured by a laser microscope is 0.14μm or more and 0.35μm or less.