| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus and an abnormality detection method of the apparatus, and a method of manufacturing a semiconductor device which are capable of detecting an abnormal event more reliably.SOLUTION: A semiconductor manufacturing apparatus has: a measurement section 38 which sequentially measures a sputtering current or a sputtering voltage supplied from a DC power source 36 for sputtering to a sputtering electrode 14; and a processing section 40 which detects that an abnormal event occurred in performing sputtering based on the fact that a sputtering current variation &Dgr;I being the amount of change per unit time of sputtering current, a sputtering voltage variation &Dgr;V being the amount of change per unit time of sputtering voltage, a first value (I/&Dgr;I) being a value obtained by dividing the sputtering current by the sputtering current variation, a second value (V/&Dgr;V) being a value obtained by dividing the sputtering voltage by the sputtering voltage variation, or a third value T based on the sum of the first value and the second value shows an abnormal value. |
